Tag: laser drill

20 Mitsubishi laser drills for micro-via processing. Hole sizes to 0.1mm. Dedicated HDI production bay for smartphones and ADAS boards.

20 Mitsubishi laser drills (5Z00U & ML605GTW5) for micro-via processing. Hole sizes down to 0.1mm for any-layer HDI. High-volume throughput for smartphones, ADAS, and 5G base stations.

PCB Drilling Guide: Mechanical, Laser, and Back-Drill TechnologyEverything you need to know about PCB drilling — from CNC mechanical drills to advanced laser micro-via and back-drill techniques.Why Drilling Defines PCB QualityDrilling is one of the m

Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug